High-Speed Package Design Engineer

Skip to main content.

View More Jobs

High-Speed Package Design Engineer

United States(Onsite)

Nokia Bell Labs is seeking a High-Speed Package Design Engineer to drive the design, simulation, and validation of advanced IC packages for high-performance RF, photonics, and mixed-signal systems.

This role focuses on end-to-end package design ownership, including architecture definition, SI/PI analysis, electromagnetic modeling, and measurement correlation, while working closely with silicon, PCB, and system integration teams. The successful candidate will also contribute to package design enablement through ADKs and reusable libraries, in close collaboration with leading EDA vendors. Package and system design leadership is the primary emphasis of this role.

This position is suitable for senior-level engineers who are comfortable taking ownership of complex package designs while influencing broader design flows and infrastructure.

Your responsibilities

• Lead the design and development of high-speed IC packages, including SiP, FC-BGA, and advanced heterogeneous integration solutions
• Define package architectures, stack-ups, routing strategies, and interconnect to meet SI/PI and RF requirements
• Perform 3D EM simulation and SI/PI analysis of package transitions, passive components, and die-to-package interfaces
• Co-optimize die, package, and PCB designs in collaboration with silicon, board, and system integration teams
• Correlate simulation results with laboratory measurements (e.g., VNA, TDR/TDT, high-speed oscilloscope)
• Contribute to the definition and evolution of package ADKs, reusable libraries, technology files, and verification flows, working in partnership with EDA vendors
• Provide technical input and design validation for vendor-supported automation and enablement efforts
• Support continuous improvement of package design methodologies and best practices across projects

Your skills and experience

Required Qualifications

• MS or PhD in Electrical Engineering, Applied Physics, or equivalent relevant industry experience
• 5+ years of hands-on experience in IC package design for high-speed, RF, or mixed-signal applications
• Strong fundamentals in electromagnetics, signal integrity, and power integrity
• Experience with 3D EM and package design tools (e.g., HFSS, CST, ADS, Allegro X APD, Xpedition, or equivalent)
• Ability to work independently and collaboratively in a cross-functional, research-driven environment

Preferred Qualifications

• Experience with advanced packaging technologies (chiplets, 2.5D/3D integration, interposers)

• Familiarity with ADKs, PDKs, or design enablement concepts, including collaboration with EDA vendors

• Working knowledge of Python and/or Tcl for design automation, simulation support, or data analysis

• PCB design and technology (e.g., Altium or equivalent)

• Apply Now

Job Info

• Job CategoryPure Research
• Posting Date06/30/2026
• Degree LevelDoctor’s degree (e.g PhD)
• Job ScheduleFull time
• Job TypeExperienced
• Job Identification34144
• Will NSA/CAPS approval be required? (E.g., accessing a US Customer Network?)No
• Role TypeIndividual contributor
• Laptop - support with ordering neededNo
• Salary RangeUS Annual Base Salary Range * USD $125,270 to $232,650

*Plus, potential incentive/variable compensation for eligible roles.

• Experience levelExperienced
• Locations600-700 Mountain Avenue, Murray Hill, New Jersey, 07974-0636, US(Onsite)
• Regular or TemporaryRegular

Similar Jobs

• Principal High Speed Mixed Signal Circuit Design Engineer\ \ United States(Hybrid)Posted on 04/17/2026\ \ The successful candidate shall possess the capability to design and analyze high-speed, high-performance analog/mixed-signal circuits, including data converters, PLLs, and SERDES, in advanced CMOS FinFET technologies. She or he shall bring the design to production. Engaging in high-speed analog circuit design gives you the chance to create the technical differentiation that will allow Infinera to hold market leadership. By building cutting-edge circuitry, we will together revolutionize the era of efficient high-speed transmission.

• Senior Digital Hardware Design Engineer\ \ Canada(Onsite)Posted on 04/21/2026\ \ Hot Job\ \ Looking for an opportunity to be part of a winning team pushing the boundaries on networking in the data center environment? \ Nokia IP is redefining DC networking with a solution built for general-purpose and AI workloads. Our high-performance fabrics, automated operations and seamless interconnectivity enable AI-driven enterprises to operate with unmatched reliability, scalability and efficiency from edge to cloud. \ \ NIDC2026

• High Speed Mixed Signal Circuit Design Engineer\ \ United States(Hybrid)Posted on 06/02/2026\ \ The successful candidate shall possess the capability to design and analyze high-speed, high-performance analog/mixed-signal circuits, including data converters, PLLs, and SERDES, in advanced CMOS FinFET technologies. She or he shall bring the design to production. Engaging in high-speed analog circuit design gives you the chance to create the technical differentiation that will allow Infinera to hold market leadership. By building cutting-edge circuitry, we will together revolutionize the era of efficient high-speed transmission.

• Signal Integrity Design Engineer\ \ United States(Onsite)Posted on 02/25/2026\ \ As a Signal Integrity Engineer, you will:\ \ Simulate ultra high-speed PCB channels (112G+ SerDes rates) including connectors, breakouts, and via structures\ Provide signal integrity guidance to Digital Hardware Designers using simulated and empirical results\ Help design PCB test boards to corroborate simulations

See More Jobs

At Nokia, we want every candidate to be able to perform their best. If you need any adjustments or support during the recruitment process, please let us know. All requests are treated confidentially.

AI Statement: Nokia embraces the strategic use of Artificial Intelligence (AI) within our recruiting process to enhance the candidate experience and significantly improve our operational efficiencies. By leveraging AI-powered tools, we aim to create a more responsive and equitable journey for all applicants. Concurrently, we advocate for the intelligent, ethical, and safe use of AI by candidates and applicants when preparing and submitting their applications for our roles. This includes ensuring that any AI-generated content is thoroughly reviewed for accuracy, originality, and relevance, and that its use aligns with principles of transparency and integrity. Our goal is to foster a recruitment environment that benefits from technological advancements while upholding fairness, authenticity, and human oversight.

American English

• Deutsch
• American English
• Français
• Português do Brasil
• 简体中文

I am an employee

We use cookies & similar technologiesLearn more

AcceptDecline

Are You Still With Us?

It seems you've been gone for a while. For security reasons we will end your session automatically in 03:00 unless you would like to continue working.

End SessionContinue Working

Work Summary

This summary is generated by AI Assist. Click inside the summary text box to make changes as necessary.

DiscardAdd Summary

Page High-Speed Package Design Engineer - Nokia Careers loaded