AI / Simulation Engineer (Thermal - Electronics Cooling)

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AI / Simulation Engineer (Thermal - Electronics Cooling)

Bangalore, Karnataka, India

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Responsibilities

• • Develop and execute Computational Fluid Dynamic (CFD) and thermal simulations for electronics cooling applications, including airflow, forced and natural convection, and conjugate heat transfer

• • Support component-, board-, enclosure-, cabinet-, and sub-system–level thermal analysis for products such as circuit breakers, PLCs, laptops, and appliances

• • Analyze industrial environments (EIA) including high ambient temperatures, enclosure heating, dust effects, and derating requirements

• • Assist in rapid model setup and simulation turnaround to support internal service requests and customer engineering needs

• • Apply appropriate boundary conditions including power losses (I²R, switching losses), contact resistance, and environmental loads

• • Support steady-state and transient thermal analyses, including power cycling, duty cycles, startup conditions, and basic fault scenarios

• • Evaluate airflow distribution in control panels, switchgear assemblies, and electronic enclosures

• • Post-process and interpret simulation results to identify thermal risks, hotspots, airflow inefficiencies, and design improvement opportunities

• • Assist in correlating simulation results with temperature rise tests, lab measurements, and field observations

• • Prepare clear technical summaries and documentation of assumptions, methods, results, and limitations

• • Support verification and validation (V&V) activities, including comparison with test data using engineering metrics

• • Engage with senior engineers to understand UL/IEC standards, certification requirements, and temperature rise limits

• • Learn and apply best practices in mesh strategy, numerical stability, convergence assessment, and result credibility

• • Support design optimization activities such as heat sink sizing, airflow path improvement, and enclosure ventilation strategies

• • Collaborate effectively with cross-functional teams (electrical, mechanical, regulatory) and contribute to a learning-oriented, supportive team culture

Qualifications

• Bachelor’s or Master’s degree in Mechanical Engineering, Thermal Sciences, Aerospace Engineering, or a related field from a reputed institution
• 4–8 years of industrial or applied experience in Computational Fluid Dynamic (CFD) and thermal-fluid simulations (internships and thesis work may be considered)
• Strong fundamentals in:
• Fluid mechanics and basic turbulence modeling
• Heat transfer (conduction, convection, radiation)
• Thermodynamics relevant to electronics cooling
• Hands-on exposure to CFD model setup, solution execution, and result interpretation
• Familiarity with at least one commercial simulation tool such as:
• ANSYS Icepak, ANSYS Fluent
• Siemens FloTHERM / FloEFD
• STAR-CCM+, COMSOL, or similar software
• Basic understanding of mesh generation and grid quality concepts, solver settings and convergence behavior
• Structured modeling workflows and technical guidelines
• Good written and verbal communication skills, with ability to explain results clearly

• Self-motivated, detail-oriented, and comfortable learning in a technically rigorous environment

• Exposure to electronics thermal management, including:
• ICs, PCBs, power electronics
• Heat sinks, fans, vents, and enclosures
• Awareness of electronics packaging constraints such as:
• Space limitations, airflow resistance
• Material properties and power dissipation
• Basic experience with thermal testing, such as thermocouple placement, temperature measurement, or data acquisition

• Introductory experience correlating simulation results with test or experimental data

• Familiarity with transient thermal behavior, power cycling, and reliability considerations
• Exposure or interest in industrial products such as circuit breakers, PLCs, switchgear, or control panels
• Interest in automation, scripting, or AI-assisted simulation workflows

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Job Info

• Job Identification10037
• Job CategoryEngineering
• Posting Date06/29/2026, 12:36 AM
• Degree LevelBachelor's Degree
• Job ShiftDay
• LocationsKalyani Platina, 3rd Floor, Bangalore, KA, 560 066, IN

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