​​Backend Process Engineer​

Location: ​ Alhambra, CA ​

Position Summary: The Backend Process Engineer – InP Wafer Fab position is responsible for development, optimization, and manufacturing support of backend wafer fabrication processes for Indium Phosphide ( InP )–based photonic devices, including DFB lasers, Semiconductor Optical Amplifiers (SOAs), and Gain Chip products. This role provides technical ownership of critical backend modules including wafer lapping/thinning, n-side metallization, rapid thermal annealing (RTA), and automated optical inspection (AOI). The position also supports singulation, optical coatings, reliability readiness, and packaging interfaces, with a strong focus on yield, defect reduction, and manufacturing stability.

Responsibilities

• Backend Process Ownership and Optimization (35%) : Own and optimize backend wafer fab processes including lapping/thinning, n-side metallization, and RTA

• Establish robust process windows, recipes, and control limits for backend modules

• Maintain stable manufacturing performance through continuous monitoring and improvement

• Yield Improvement, Defect Reduction, and AOI Control (25%) : Own and maintain AOI processes for backend defect detection and yield monitoring

• Drive singulation yield improvement and defect reduction through data analysis and root-cause investigations

• Analyze inline and post-process data to identify trends and systematic issues

• Implement corrective and preventive actions and verify effectiveness

• Singulation, Optical Coatings, and Packaging Interface Support (20%) : Support cleaving, dicing, and singulation processes to ensure device integrity

• Provide process engineering support for AR/HR optical coatings and vendor qualifications

• Collaborate with packaging, device, and reliability teams to ensure packaging readiness

• New Product Introduction and Technology Support (10%) : Support new product introduction (NPI), process transfers, and technology changes

• Evaluate backend process risks associated with new designs , materials, and device structures

• Documentation, Process Control, and Manufacturing Support (10%) Author and maintain SOPs, travelers, process specifications, and control plans

• Define SPC metrics and control strategies for backend processes

• Provide hands-on manufacturing and troubleshooting support as needed

Minimum Qualifications

• Bachelor’s degree or higher in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or a related field

• Minimum of 3+ years of experience in backend semiconductor processing

• Hands-on experience with lapping/thinning, metallization, and thermal processes

• U nderstanding of InP -based or III-V compound semiconductor wafer fabrication processes

• Experience with AOI systems, yield analysis, and data-driven process improvement

• Strong understanding of singulation, packaging interfaces, and reliability requirements

• Proficiency in SPC, DOE, and statistical analysis

• Ability to work across cross-functional manufacturing and engineering teams

• Preferred experience with InP or III-V optoelectronic devices

• Familiarity with AR/HR optical coating processes

• Experience supporting high-mix, low-volume manufacturing environments preferred

• The intent of this job description is to describe the major duties and responsibilities performed by incumbents of this job. Incumbents may be required to perform job-related tasks other than those specifically included in this description.

• All duties and responsibilities are essential job functions and requirements and are subject to possible modification to reasonably accommodate individuals with disabilities.

• A reasonable estimate of the pay range for this position is $100,000 - $135,000. There are several factors taken into consideration in determining base salary, including but not limited to: job-related qualifications, skills, education and experience, as well as job location and the value of other elements of an employee’s total compensation package.

• #LI-Onsite