Padmi
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Microsoft

cloud computing (Azure) · AI and machine learning (Copilot, CoreAI)

Senior Quantum Package & Motherboard Engineer

Seattle · OnsitePosted 27 days ago
HardwareSeniorFull TimeH-1B track record
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Develop and maintain robust Package & Motherboard design processes for quantum devices. Document processes and implement across our global team. Design & drive external packaging material vendors to leverage existing supply chains to deliver solutions needed for packaging of quantum devices. Design & drive PCB designs to deliver solutions needed for cryo/quantum solutions. Simulate Packaging/Motherboard components for Signal & Power Integrity. Own signaling chain - including specifications, material / connector / cable definition from Room-Temperature to Cryo/Quantum temperature logic. Develop and improve electrical and PCB development processes, documentation, quality frameworks, design review practices, design for manufacturing, testability, and validation workflows, manufacturing readiness processes, dashboards, and reporting mechanisms. Apply AI to accelerating Analog Layout execution times Apply AI to accelerating Analog Layout execution times Doctorate in Physics, Engineering, or related field AND 1+ year(s) experience in industry or in a research and development environment, could include completion of a post doctoral research position OR Master's Degree in Physics, Engineering, or related field AND 4+ years experience in industry or in a research and development environment OR Bachelor's Degree in Physics, Engineering, or related field AND 6+ years experience in industry or in a research and development environment OR equivalent experience. Ability to leverage artificial intelligence (AI) tools to drive innovation and efficiency (e.g., measurement, performance modeling and analysis, research gathering, day-to-day task automation). Ability to work in an “AI-first” environment using modern AI tools to accelerate discovery through hardware development. Bachelors or Masters Degree in Electrical Engineering or related field. 10+ years design experience in Silicon Package Design and PCB Design. Successfully delivered Silicon Packages and Motherboards into production. Knowledge of industry standard tools/methodologies for Package and PCB Design. Proficient in Analog Signal, Power Integrity & Signal Integrity simulations. Self-starter with the ability to define and adhere to a schedule. Good inter-personal skills, able to interface with a variety of external partners (customers, architects, designers, project managers, etc.) and are able to deliver complete layouts to customers. Experience working directly with PCBs and/or superconducting integrated circuit design teams, fabrication vendors, electronics manufacturing services and contract manufacturers (EMS/CMs), and external suppliers. Experience working directly with PCBs and/or superconducting integrated circuit design teams, fabrication vendors, electronics manufacturing services and contract manufacturers (EMS/CMs), and external suppliers.

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