Padmi
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Microsoft

cloud computing (Azure) · AI and machine learning (Copilot, CoreAI)

Principal Optical Packaging Engineer

United Kingdom · OnsitePosted 1 month ago
HardwareStaff+Full Time
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CPO Architecture & Packaging Co-Design - Lead the design and development of packaging architectures for co-packaged optics, including integration of photonic devices, ASICs, and interposers. Advanced Packaging Development - Define and prototype packaging solutions leveraging technologies such as 2.5D/3D integration (e.g., FOWL, CoWoS, EMIB, SOIC/HB etc), fiber attach, optical coupling, and thermal management. Optical Assembly & Alignment Strategy - Develop scalable optical assembly processes, including alignment tolerances, passive/active alignment strategies, and manufacturability trade-offs. Cross-Disciplinary Co-Design - Work closely with photonics, electronics, and system teams to co-optimize packaging, signal integrity, power delivery, and thermal performance. Partner Engagement & Technology Transfer - Collaborate with Tier-1 suppliers and ecosystem partners to realize packaging solutions and drive technology towards production readiness. Prototyping, Validation & Iteration - Build and evaluate prototypes, identify key failure modes, and iterate designs based on measurement data and system-level constraints. Master's or PhD's degree in Electrical Engineering, Photonics, Materials Science, or a related field. Ability to operate effectively in a multi-disciplinary environment. Experience in advanced semiconductor packaging (e.g., FCBGA, 2.5D/3D integration). Familiarity with hyperscale data center interconnect requirements. Experience working with external manufacturing partners or Tier-1 suppliers. Track record of delivering packaging solutions from concept to prototype or production. Background aligned with leading CPO practitioners (e.g., industry or research experience similar to co-packaged optics leaders). Has deep, practical experience in co-packaged optics, not just electronic packaging. Can operate at the interface between research and productization. Understands real-world constraints: yield, assembly, cost, reliability. Brings a systems mindset, connecting packaging decisions to overall architecture. Thrives in a highly collaborative, cross-disciplinary environment.

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