Mechanical Designer - Cryomechanical Systems

Own end-to-end three-dimensional (3D) computer-aided design (CAD) for cryogenic subassemblies and top-level mechanical integrations, including cold fingers, millikelvin (mK) and 4 kelvin (4 K) stages, radiation shields, vacuum interfaces, and cable or harness routing fixtures; create fully detailed two-dimensional (2D) drawings with geometric dimensioning and tolerancing (GD&T) and tolerance stackups. Build and steward the top assembly and bill of materials (BOM) by managing part numbering, configurations, engineering change order (ECO) and engineering change request (ECR) workflows, and product data management/product lifecycle management (PDM/PLM) toolchains such as SolidWorks, Windchill, and OnePDM. Lead Cryomechanical Engineering (CryoME) design reviews using standard review packages that include three-dimensional (3D) computer-aided design (CAD), two-dimensional (2D) drawings, critical-to-function specifications, materials, coatings, finishes, incoming quality control (IQC), cryogenic screening plans, manufacturing and assembly flows, risks, and schedules. Translate system requirements into mechanical specifications for thermal anchoring, heat-load budgets, coefficient of thermal expansion (CTE) mismatch management, vacuum sealing, vibration isolation, radio frequency (RF) and direct current (DC) cable management, and integration across temperature stages. Plan and document component screening, integration readiness, and product development gates by creating incoming quality control (IQC) plans, cryogenic pre-screening checklists, design release artifacts, and handoff documentation in partnership with systems, measurement, packaging, control/readout, and instrumentation teams. Drive design for manufacturing/design for excellence (DFM/DFX) with suppliers by generating clear build packages, supporting fabrication through first-article approval, dispositioning nonconformances with data-driven tolerance and fit assessments, and capturing as-built changes in drawings and bills of materials (BOMs). Master's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 2+ years technical engineering experience Ability to leverage artificial intelligence (AI) tools to drive innovation and efficiency, such as performance modeling and analysis, research gathering, and day-to-day task automation. Ability to work in an artificial intelligence (AI)-first environment using modern artificial intelligence (AI) tools to accelerate discovery through hardware development. Doctorate in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field OR Master's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 3+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 5+ years technical engineering experience OR equivalent experience. Expert CAD skills (PTC Creo strongly preferred): proven record creating complete 3D models from scratch and releasing production grade drawings. Mastery of GD&T (ASME Y14.5) and tolerance analysis for precision assemblies; ability to close loops between stack‑ups, manufacturability, and assembly sequencing. PDM/PLM proficiency for configuration control and BOM accuracy (Windchill, OnePDM or similar). Design review leadership and clear documentation practices (review packages, checklists, risks, decisions, and release artifacts) per our CryoME templates. 1+ year of experience integrating hardware inside dilution refrigerators across temperature stages, including millikelvin (mK) through 300 kelvin (K), thermal modeling or anchoring, and harnessing for radio frequency (RF) or direct current (DC) lines. 1+ year of experience using finite element analysis (FEA) or thermal simulation tools such as ANSYS Mechanical or COMSOL, including correlation to measurement or test data. 1+ year of experience applying radio frequency (RF)-aware mechanical design practices, including connector standards, shielding, controlled routing, strain relief, or microwave component packaging for low-noise systems. 1+ year of hands-on cryogenic, vacuum, or ultra-high vacuum (UHV) hardware experience, including materials, coatings, finishes for cryogenic service, vacuum seals, thermal interfaces, wiring fixtures, or low-outgassing practices. 1+ year of experience partnering with suppliers or manufacturing teams to support precision machining, sheet metal, special processes, cleaning, vacuum bakeouts, cryogenic-compatible finishes, or first-article builds. 1+ years of experience operating within regulated or high-security lab environments and collaborating across distributed teams or sites. Experience contributing to inclusive, cross-disciplinary engineering teams by communicating decisions clearly, inviting diverse perspectives, and helping create an environment where team members can do their best work.