Source description
About the role
Technical Leadership
· Lead PCB layout architecture for complex multi-layer designs (10–20+ layers) including high-speed digital, RF, analog, and power circuitry · Define and own stackups, impedance models, and via strategies (through, blind, buried, microvias, backdrilling) · Serve as the DFM authority for layout decisions, balancing electrical performance, cost, yield, and reliability Advanced PCB Design & Layout · Perform and guide component placement optimizing signal integrity, power integrity , EMI/EMC, thermal, and mechanical performance · Route high-speed serial interfaces, differential pairs, controlled-impedance nets, and sensitive RF/analog signals · Design robust power distribution networks and grounding structures · Apply advanced shielding and isolation techniques for EMI/EMC control Fabrication & Assembly Interface · Lead DFM/DFA reviews with PCB fabrication and assembly partners · Resolve complex DFM issues related to: o HDI structures and sequential lamination o Via consolidation, backdrilling, and drill count reduction o Stackup optimization for yield and cost · Optimize designs for manufacturability, reliability, and volume production Cross-Functional Collaboration · Work closely with electrical, mechanical, test, and manufacturing engineers throughout the product lifecycle · Support board bring-up, debug, ECOs, and production transitions · Mentor and technically guide junior PCB layout engineers Documentation & Process Ownership · Create and review stackup drawings, fabrication notes, assembly notes, and manufacturing data packages (Gerber / ODB++) · Establish, maintain, and enforce PCB layout standards and best practices · Drive continuous improvement in layout quality, DFM compliance, and cost efficiency
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