Application Engineering Director

Bachelor's or Master's degree in Materials Science, Chemistry, Electrical Engineering, Mechanical Engineering, or a related field with a minimum of 8+ years of experience in semiconductor packaging and/or thermal management applications.

Deep understanding of semiconductor packaging technologies, thermal management principles, and material characterization techniques, including advanced packaging basic understanding, including 2.5D/3D IC thermal solutions. Demonstration of exceptional ability and accomplishments, including hands-on development, integration, troubleshooting, and implementation of solutions. Ability to execute from concepts and R&D to scaling and mass production.

Strong knowledge of the semiconductor industry, systems engineering, reliability and compliance demonstration, and technology transfers, particularly in advanced packaging and thermal management.

Proven ability to lead and manage cross-functional engineering teams, coupled with excellent communication, presentation, and interpersonal skills to support both internal collaboration and external business development and customer engagement.

Experience with high thermal conductivity materials and advanced packaging.