IC Package Design Engineer

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IC Package Design Engineer

Austin Metro Area, Texas, United StatesHardware

Austin Metro Area, Texas, United StatesLos Angeles Metro Area, California, United StatesSan Francisco Bay Area, California, United StatesWork Locations (3)

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Our Packaging team defines, designs, and integrates advanced electronic packaging solutions for Apple’s internal and custom components across products including iPhone, iPad, Mac, Apple Watch, and Apple TV. We’re looking for a Package Design Engineer to drive the physical design and integration of advanced semiconductor packages across SoC, memory, RF, and cellular technologies. You will play a key role in shaping the architecture, scalability, and efficiency of next-generation products while advancing design methodologies through automation and AI.

As a Package design engineer, you will lead advanced package architecture, drive next-generation package structure and configuration optimization, and own Package/SiP/module physical design from concept through tape-out. You will collaborate closely with cross-functional teams to deliver optimized SI/PI performance across a wide range of silicon technologies You are expected to leverage AI tools to enhance design efficiency, quality and performance.

• Perform physical layout of package substrates for diverse silicon, including System-on-Chip (SoC), Memory, RF, and cellular integrated circuits (ICs).

• Execute parasitic extraction (RLGC) and S-parameter modeling to validate that package designs meet Signal and Power Integrity (SI/PI) performance targets.

• Lead cross-functional collaboration on package feasibility and system co-optimization; align with Product Design on chip floorplan, System Architecture on package configuration, and Silicon/SIPI teams on electrical performance.

• Drive package design methodology improvements by evaluating new CAD tools and developing automated design and verification flows to enhance efficiency and streamline the release process.

• BS and 10+ years of relevant industry experience

• Package Design Proficiency: Proven experience in IC package physical design using Cadence Allegro or Mentor Xpedition platforms, with knowledge of diverse package types (SiP, PoP, wirebond) and verification tools (Calibre, CAM350).

• High-Speed & SI/PI Expertise: Strong understanding of high-speed interface layout constraints (DDR, PCIe) and Signal/Power Integrity (SI/PI) analysis, including experience with simulation tools like HFSS or PowerSI and parasitic extraction (RLGC, S-parameters).

• Manufacturing & Materials Knowledge: Solid grasp of substrate manufacturing processes, design rules (DRC), design for manufacturability (DFM), and various sophisticated package configurations and assembly technology

• Automation & Scripting Skills: Familiarity with a Unix/Linux environment and proficiency in scripting languages such as Python, Perl, or TCL to automate design tasks and improve workflows.

Apple is an equal opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant

At Apple, we believe accessibility is a fundamental human right. You’ll find that idea reflected in everything here — in our culture, our benefits and our digital tools. By welcoming as many perspectives as possible, we help you build a career where you feel like you belong.

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Apple accepts applications to this posting on an ongoing basis.

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